• <u id="b671a9" ><code id="b671a9" ></code></u>

    <listing id="b671a9" ></listing>

  • <listing id="b671a9" ><td id="b671a9" ></td></listing>

      <p id="b671a9" ></p>

      <blockquote id="b671a9" ></blockquote>

      1. <bdo id="b671a9" ></bdo><s id="b671a9" ><rp id="b671a9" ><button id="b671a9" ></button></rp></s>
      2. <strike id="b671a9" ><optgroup id="b671a9" ></optgroup></strike>
        본문 바로가기
        Package Substrate

        The product is a package substrate that is used for the core semiconductors of mobile devices and PCs. It transmits electric signals between semiconductors and the main board. Compared with general substrates, as this substrate is a high-density circuit substrate containing more microcircuits, the assembly defects and incurred costs in directly bonding expensive semiconductors to the substrate can be reduced.

        2019双色球公式计算法

        This is called Flip Chip Chip Scale Package (FCCSP) as semiconductor chips are upturned and connected to a board through a bump rather than wire bonding. It is mainly used for the application processor (AP) chips of mobile IT devices.

        General Features

        • High performance : High performance is realized through the minimization of the Chip ↔ PCB distance that results in less signal loss
        • High I/O : I/O is formed in large quantities due to microbump pitch

        Application

        • Mobile Application Processor, Baseband and Others

        2019双色球公式计算法

        Compared to WBCSP using Gold Wire, the process using Flip Chip can be applied to high-density semiconductors because the route of electrical signals is shorter, and larger input and output can be accommodated.

        Core Technology of FCCSP 浙江福利彩票双色球

        Different from wire bonding, input and output are formed on the semiconductor (chip) through an area array, and then the chip is flipped and connected to the PCB

        Feature of FCCSP 浙江福利彩票双色球

        BSP(Blue Stencil Printing)

        For the first time in the world, BSP method is applied to mass production

        • Available for fine bump pitch
        • Good for small bump risk
        • High productivity of bump processing
        • Competitive price by high productivity & high yield

        EPS(Embedded Passive Substrate)

        EPS is a substrate that has an internally embedded semiconductor passive component.

        EPS(Embedded Passive Substrate) 浙江福利彩票双色球

        The decoupling capacitor is normally used to stabilize the power supply voltage level. When embedded inside a substrate, power ground/network inductance can be reduced.

        ETS(Embedded Trace Substrate)

        ETS is a circuit board whose circuit pattern is in the insulating material.

        浙江福利彩票双色球

        ETS has a coreless structure, which allows for the implementation of microcircuits without the need for additional cost. Layer Down is performed much easier (4L → 3L).

        As the etching process is not affected by the pattern width, the circuit width can be precisely controlled.

        2019双色球公式计算法

        Line-up by Specification

        • Mass Production
        • Sample Available
        Line-up by Specification
        Mass Production Sample Available
        Routing Density Build-up L/S Mass Production9 / 12 Sample Available10 / 10
        BVH / Pad Registration Mass Production60 / 90 Sample Available60 / 85
        SRO Dia. SR Registration Mass Production64 ± 15 Sample Available55 ± 10
        FC Bump Pitch (Peripheral) Mass Production35 Sample Available30
        FC Bump Pitch (Area) Mass Production130 Sample Available125
        Low Z-Height Core / PPG Mass Production60 / 25 Sample Available40 / 25
        Cu / SR Thickness Mass Production10 ± 5 Sample Available8 ± 4

        2019双色球公式计算法

        Certificate Certification Standards, Certification No, Issue Date, Expiry Date, Certification 등이 있습니다.
        Certification Standards Certification No Issue Date Expiry Date Certification
        ISO 14001 KE191620 2019-06-10 2022-06-24 Download
        ISO 14001 EMS_646840 2018-09-06 2021-09-05 Download
        ISO 45001 KS19017 2019-06-10 2022-06-09 Download
        ISO 50001 18213-I 2019-05-17 2021-08-19 Download

      3. <u id="b671a9" ><code id="b671a9" ></code></u>

        <listing id="b671a9" ></listing>

      4. <listing id="b671a9" ><td id="b671a9" ></td></listing>

          <p id="b671a9" ></p>

          <blockquote id="b671a9" ></blockquote>

          1. <bdo id="b671a9" ></bdo><s id="b671a9" ><rp id="b671a9" ><button id="b671a9" ></button></rp></s>
          2. <strike id="b671a9" ><optgroup id="b671a9" ></optgroup></strike>