High-density interconnection (HDI) substrates have high-density circuits that make it possible for electronic parts mounted on a PCB to send and recieve electrical signals between themselves. The products are used for mounting the main parts of mobile devices and transmitting their signals.
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- Improves the performance of products because of high integration
- Makes it easier to automate the assembly of PCBs
- Reduces total costs
- Smart Phone, Note PC, Tablet, etc.
SAVIA (SAMSUNG All layer VIA) allows for transmission of signals at high speeds by making PCBs smaller and shortening signal paths.
All Layer Via is formed across all layers through fill plating. Staggered Via is formed through transmission and reflection.
Stiffness is enhanced by using thin materials with high coefficient of elasticity. Electric signal characteristics are excellent as materials of low permitivity are used.
Stiffness is increased by applying materials with high coefficient of elasticity, and thereby improving the quality of partsmounting through the enhanced flex characteristics of slim PCBs (60 ㎛ CCL, 40/50 ㎛ Prepreg).
Electric signal characteristics are excellent as microcircuits and materials of low Dk (low permitivity) are applied.
Cavity PCBs have step differences in the areas where components are mounted. They allow a reduction in the overall thickness even if a thick component is mounted.
There are two cavity types: noncomponent and component. Whereas the former type cannot be mounted with components, the latter has SRs and pads formed in a way that allows the mounting of components.
Non Component Type
Reducing thickness of specific area
Reduce the thickness of an assembled device
※ HDI desing rules remain the same (0.4 Pitch)
Key Core Technologies
Develops slim and ultrafine circuit technologies of HDI through the convergence and integration of BGA/FCBGA technologies.
Line-UP of Any Layer and Main Products
- Mass Production
- Sample Available
|Type||Mass Production||Sample Available|
|Litho. Process||Mass Production →||Sample AvailablemSAP|
|BGA Pitch||Mass Production0.35||Sample Available0.35|
|Line width / space||Mass Production30 / 40||Sample Available25 / 25|
|Via / Land||Mass Production90 / 168||Sample Available70 / 150|
|Via Structure||Mass Production →||Sample Available →|
|Core Thickness||Mass Production50||Sample Available40|
|Dielectric Thickness||Mass Production25||Sample Available20|
|Total Thickness||8L||Mass Production0.40||Sample Available0.35|
|10L||Mass Production0.60 (12L 0.65T)||Sample Available0.60|
|Dk / Df||Mass Production→||Sample Available3.2 / 0.004|
|Certification Standards||Certification No||Issue Date||Expiry Date||Certification|
|ISO 9001 & IATF 16949||IATF_91430-003||2018-01-08||2021-01-07||Download|