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        HDI(High Density Interconnection)

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        High-density interconnection (HDI) substrates have high-density circuits that make it possible for electronic parts mounted on a PCB to send and recieve electrical signals between themselves. The products are used for mounting the main parts of mobile devices and transmitting their signals.

        General Features

        • Improves the performance of products because of high integration
        • Makes it easier to automate the assembly of PCBs
        • Reduces total costs

        Application

        • Smart Phone, Note PC, Tablet, etc.

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        SAVIA (SAMSUNG All layer VIA) allows for transmission of signals at high speeds by making PCBs smaller and shortening signal paths.

        Features

        All Layer Via is formed across all layers through fill plating. Staggered Via is formed through transmission and reflection.

        Slim PCB

        Stiffness is enhanced by using thin materials with high coefficient of elasticity. Electric signal characteristics are excellent as materials of low permitivity are used.

        High Stiffness

        Stiffness is increased by applying materials with high coefficient of elasticity, and thereby improving the quality of partsmounting through the enhanced flex characteristics of slim PCBs (60 ㎛ CCL, 40/50 ㎛ Prepreg).

        Impedance Matching

        Electric signal characteristics are excellent as microcircuits and materials of low Dk (low permitivity) are applied.

        Cavity Type

        Cavity PCBs have step differences in the areas where components are mounted. They allow a reduction in the overall thickness even if a thick component is mounted.

        There are two cavity types: noncomponent and component. Whereas the former type cannot be mounted with components, the latter has SRs and pads formed in a way that allows the mounting of components.

        Non Component Type

        Reducing thickness of specific area

        • High Volume Manufacturing
        • Depth : ~ 400 ㎛
        • Application
          Wearable Device

        Component Type

        Reduce the thickness of an assembled device
        ※ HDI desing rules remain the same (0.4 Pitch)

        • Under Developing
        • Depth : ~ 250 ㎛
        • Application
          - Smart Phone
          - Tablet PC / Note PC

        Key Core Technologies

        Develops slim and ultrafine circuit technologies of HDI through the convergence and integration of BGA/FCBGA technologies.

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        Line-UP of Any Layer and Main Products

        • Mass Production
        • Sample Available
        HDI(HIGH DENSITY INTERCONNECTION) Line-Up
        Type Mass Production Sample Available
        Litho. Process Mass Production Sample AvailablemSAP
        BGA Pitch Mass Production0.35 Sample Available0.35
        Line width / space Mass Production30 / 40 Sample Available25 / 25
        Via / Land Mass Production90 / 168 Sample Available70 / 150
        Via Structure Mass Production Sample Available
        Core Thickness Mass Production50 Sample Available40
        Dielectric Thickness Mass Production25 Sample Available20
        Total Thickness 8L Mass Production0.40 Sample Available0.35
        10L Mass Production0.60 (12L 0.65T) Sample Available0.60
        Dk / Df Mass Production Sample Available3.2 / 0.004

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        Certificate Certification Standards, Certification No, Issue Date, Expiry Date, Certification 등이 있습니다.
        Certification Standards Certification No Issue Date Expiry Date Certification
        ISO 14001 KE191620 2019-06-10 2022-06-24 Download
        ISO 14001 EMS_646840 2018-09-06 2021-09-05 Download
        ISO 45001 KS19017 2019-06-10 2022-06-09 Download
        ISO 50001 18213-I 2019-05-17 2021-08-19 Download
        ISO 9001 & IATF 16949 IATF_91430-003 2018-01-08 2021-01-07 Download

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